| 摘要 |
PURPOSE:To obtain the titled composition for sealant, having high fluidity of resin in molding, exhibiting excellent mold releasability, and giving a cured product having low heat-expansion coefficient and low rate of internal reaction, by dispersing silicone gel in the epoxy resin in the form of fine particles. CONSTITUTION:The objective composition is produced by using (A) 100pts.(wt.) of an epoxy resin and (B) 1-100pts. of a silicone gel as main components, and dispersing the component B in the component A in the form of fine particles. The component B is preferably the one having a penetration of >=80 at 25 deg.C, consistency of >=30, and compression modulus of <=1X10<6>dyn/cm<2>, and obtained e.g. by reacting a vinyl-containing organopolysiloxane with an SiH-containing organohydrogen polysiloxane in the presence of a platinum-group compound. |
