发明名称 METHOD AND APPARATUS FOR INSPECTING BONDING STATE
摘要 PURPOSE:To rapidly and accurately judge the presence and absence of the defect in a bonded region, by determining an atmospheric condition from a short-time temp. change due to heating receiving no influence of the presence and absence of the defect in the bonded region, and correcting temp. change over a long time. CONSTITUTION:The inspection part 11 provided to the surface of a lead 9, which is bonded to a base plate surface 10 by solder, opposite to the bonding surface thereof is heated by the irradiation of laser beam from a heating source 12 through a shutter 13 controlled by a control part 19. In this case, thermal radiation is detected by a detector 15 and the surface state determining part of the control part 9 determines correction coefficient corresponding to an atmospheric condition responding to a surface inclination or state from short-time temp. change receiving no influence of the presence and absence of the defect in the bonded region. Temp. change over a long time corresponding to the defect in the bonded region is corrected on the basis of this correction coefficient by the calibration part of the control part. By this constitution, the presence and absence of the defect in the bonded region is judged rapidly and accurately without spending a long time in inspection preparation.
申请公布号 JPS6073347(A) 申请公布日期 1985.04.25
申请号 JP19830180687 申请日期 1983.09.30
申请人 HITACHI SEISAKUSHO KK 发明人 HIROI TAKASHI;NINOMIYA TAKANORI;NAKAGAWA YASUO
分类号 G01N25/72;(IPC1-7):G01N25/72 主分类号 G01N25/72
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