发明名称 CERAMIC CASE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent swelling of low-melting point glass at the time of compression and bonding of a lead frame and to eliminate poor bonding, by changing the thickness of the low-melting point glass. CONSTITUTION:Low-melting point glass 1' is applied to a main body 4. The thickness of a part, to which a lead frame 2 is compressed, is changed from the thickness of the other part. Namely, the low-melting point glass 1', which is applied to the main body 4, is divided into a part 5, which has an ordinary thickness, and a recess part 6, which conforms to the shape of a lead frame 3. The lead frame 2 is compressed and bonded to the recessed part 6 and to the low melting point glass 1' without pushing aside a large amount of the low-melting point glass 1' and without deviation of the lead frame 2.
申请公布号 JPS622636(A) 申请公布日期 1987.01.08
申请号 JP19850142031 申请日期 1985.06.28
申请人 NEC KYUSHU LTD 发明人 KUBO HIROSHI
分类号 H01L23/10;(IPC1-7):H01L23/10 主分类号 H01L23/10
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