| 摘要 |
PURPOSE:To facilitate a bonding without shortcircuit and a standardization of a semiconductor device by forming the device of a film carrier having a plurality of wiring leads on both side surfaces of a film and a semiconductor chip in which wiring leads and electrodes are connected. CONSTITUTION:Wiring lead 2, 2' and bonding pads 3, 3' connected to one ends of the leads are provided on both side surfaces of a film 1. A resin film having 100mum of thickness is cut in width of 30mm., sprocket holes 7 and pellet holes 4 are punched at the film, and copper foils 8 are thermally press-bonded to both side surfaces of the film. Then, photoresists are coated on both side entire surfaces of the foils 8, and exposed via a pattern mask simultaneously on both side surfaces at every one frame. Unecessary copper is removed by etching to form a wiring pattern. Then, a gold plating is formed on the surface of the copper. Eventually, a wiring portion shortcircuited for plating is punched to obtain a film carrier. |
