发明名称 CONTROLLING METHOD OF EVAPORATION RATE
摘要 PURPOSE:To control the evaporation rate of a plating metal and to perform plating to a uniform thickness by controlling the surface level of the plating metal bath contained in the vessel of a vapor source, detecting the temp. of the bath surface and regulating the output of a heater for heating the plating bath. CONSTITUTION:An electrical signal circuit is formed of an electrode 15 immersed in a plating metal bath 3, an electrode 16 installed on a bath surface level 9 and a power source 17. When electric current flows through the level 9 between the electrodes 15 and 16, the signal is received by a relay circuit 18 which moves downward the top end 22 in the upper part of a hydraulic type lifting device 21. When the current does not flow through the level 9, the device 21 is moved upward whereby the level 9 is controlled constant. The top end of a thermocouple 11 is installed at the same level as the top end of the electrode 16 and the temp. on the bath surface is always detected. The output of a heater 14 is adjusted by a temp. controller 12 and a power source 13 whereby the temp. of the bath surface 9 is maintained constant.
申请公布号 JPS59107075(A) 申请公布日期 1984.06.21
申请号 JP19820217071 申请日期 1982.12.13
申请人 MITSUBISHI JUKOGYO KK 发明人 NAKAGAWA YOSHIKIYO
分类号 C23C14/24;C23C14/54 主分类号 C23C14/24
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