| 摘要 |
PURPOSE:To facilitate the formation of a pattern and to ensure the connection of the pattern, by forming electrodes for a power source and grounding at the bottom of a chip carrier, thereby expanding the area of the wiring pattern. CONSTITUTION:At the back surface of a chip carrier 7, a plurality of signal line connecting electrodes 8 and power source and grounding electrodes 9 are provided on a part from the peripheral side to the bottom surface. A pad for outer leads 10 is connected to the electrodes 8 or the electrodes 9. Electrodes 16 and 15 are provided at the positions corresponding to the electrodes 8 and 9 on a mounting substrate 14. The substrate 14 and the carrier 7 are connected by a solder 7. In this structure, the electrodes 8 and 9 are simultaneously formed, the importatn connection of the power source and grounding can be ensured and performed at low resistance, and the heat radiation effect becomes large owing to the electrode conductors at the back surface. |
