| 摘要 |
PURPOSE:To aviod the damage of a bonding part due to a testing by dividing and forming a testing part and another bonding part separate from the testing part when a pad is formed on a semiconductor substrate, then testing it and then covering the entire surface with a passivation film while exposing the testing part. CONSTITUTION:A field SiO2 film 2 is grown on a semiconductor substrate 1, a fuse 3 made of polycrystalline Si is formed on the part of the film 2, a PSG film 4 is covered on the overall surface which inculdes the fuse, and the fuse 3 is exposed by photoetching. Then, aluminum wirings 5 and bonding pad 6 are respectively formed on the film 4, the pad 6 is formed in a slender shape, one end is used as a testing part 9, and the other end is used as a bonding part 10. Subsequently, a probe 11 is pressed on the testing part 9 fr testing, a passivation film 7 is covered on the overall surface while exposing the bonding part 10 after testing, and wires 8 are mounted on the part 10. |
