| 摘要 |
PURPOSE:To improve finishing speed and accuracy in a polishing apparatus for finishing a mirror surface by attaching a plurality of polishing pads with different hardness and surface roughness to a surface plate. CONSTITUTION:On a surface plate 1 mounted on a rotary table 10 are laid concentrically polishing pads 11-13 with rough, medium and fine roughness in the order arranged from the outer periphery. On the other hand, a work O such as silicon wafer is mounted by adsorption, adhesion, etc. on a work holder 2 supported rotatably and swingably by a ball joint 3 and lowered onto the rotating surface plate. And a work 21 lowered first onto the pad 1 rotates with the peripheral difference to be flattened efficiently. Next, a work 22 lowered onto the pad 12 is subjected to the secondary finish and a work 23 finally lowered onto the pad 13 is subjected to mirror finish with fine surface roughness and small peripheral speed. Thus, the finishing speed and accuracy can be improved and the number of manual operation is reduced. |
