| 摘要 |
In a process for producing printed circuit boards using a photopolymer epoxy resin having a Probimer structure and which is applied as a liquid resist, solder resist or insulating lacquer to one or both sides of a base material of the printed circuit board, before the Probimer is exposed to UV radiation so as to reproduce a photographic master, the entire uncured Probimer layer is pre-exposed to UV radiation in order to sensitise it with an amount of light which is such that subthreshold preexposure takes place which fails to bring about any curing which can be detected by a test development process. The main exposure for reproducing a photographic master directly follows the preexposure.
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