| 摘要 |
<p>PURPOSE:To cheaply perform division processing without using a special porous film as a film on which a wafer is bonded, by a method wherein a usual flexible high molecular film is used so as to obtain a film having the same effect as the special porous film. CONSTITUTION:A film 12 is placed with its surface including an adhesive 11 up on a suction mount 8 formed with grooves 7 in concentric relation with a small hole 6, and it is suctioned and fixed by an exhaust pump. A perforating jig 10 is lowered toward the suction mount 8 from above to bore fine holes 13 in positions corresponding to needles 9. In this state, the film 12 becomes a film having the same function as a porous film. A wafer 14 is placed on the surface of the film 12 including the adhesive 11 and suctioned by the exhaust pump, so that both are bonded with each other and fixed. The film 12 having the wafer 14 bonded thereon is removed out of the suction mount 8 and the wafer is cut along the division lines by a laser or so, thereby to form a plurality of chips.</p> |
