| 摘要 |
PURPOSE:To initiate an electroless plating reaction on an electrically conductive member to be plated without contaminating a plating soln. or requiring an external power source by connecting the member on which electroless plating does not take place or hardly takes place to an active member with a lead wire. CONSTITUTION:An active member A activated by immersion in an active noble metal soln. or other method is immersed in an electroless plating soln. The electric potential of the member A lowers to plating deposition potential in a moment. A member B of copper, stainless steel, titanium, carbon or the like to be plated is then immersed in the plating soln. Since the electric potential of the member B does not lower to plating deposition potential, plating does not proceed. When the members A, B are connected with a lead wire, the electric potential of the member B also lowers to plating deposition potential and a plating reaction is initiated. Thus, activation of the member to be plated before electroless plating is made unnecessary. This method is suitable for the production of hybrid IC. |
