发明名称 EDGE CLIP TERMINAL FOR MOUNTING THICK FILM HYBRID CIRCUITS IN PRINTED CIRCUIT BOARDS
摘要 <p>D-24,330C EDGE CLIP TERMINAL FOR MOUNTING THICK FILM HYBRID CIRCUITS IN PRINTED CIRCUIT BOARDS By Paul R. Ellis, Jr. An improved edge clip terminal having a diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead section. In an assembly, the second lead sections of a plurality of terminals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sections are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it.</p>
申请公布号 CA1139011(A) 申请公布日期 1983.01.04
申请号 CA19820398189 申请日期 1982.03.11
申请人 GTE AUTOMATIC ELECTRIC LABORATORIES INCORPORATED 发明人 ELLIS, PAUL R., JR.
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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