| 摘要 |
PURPOSE:To provide a compounded composition having high thermal adhesivity and broad heat-sealing initiation temperature range, and suitable for sealing and for loaded film packaging, by compounding a specific butene-1-propylene copolymer with a specific propylene-etylene copolymer. CONSTITUTION:A composition having a permissible thermal adhesion temperature range of 200-290 deg.F and heat sealing initiation temperature of 180-290 deg.F can be produced by compounding (A) a butene-1-propylene copolymer having a propylene content of 12-30(wt)%, preferably 15-25%, especially 20% with (B) a propylene-ethylene copolymer having an ethylene content of 2.5-10%, preferably 5-7%, especially 6%, at a weight ratio (A:B) of 40:60-75:25, preferably 60:40-70:30, especially 65:35. The composition is applied to the surface of a polypropylene film or polypropylene-based copolymer film used as a core layer, by coating or co-extrusion.
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