| 摘要 |
PURPOSE:To enable soldering at comparatively low temperatures, by breaking an insulation material of wire end, soldering at higher temperatures, guiding to a terminal pin of a terminal board, binding, wiring, and again soldering at lower tempperatures. CONSTITUTION:A wound drum-core bobbin 3 moves upward to a soldering tank 8 filled with smelted solder over 400 deg.C by means of a bobbin chuck 2. At the same time, the soldering tank rises to touch a designated position of terminal drawer 5. A soldered portion 9 is formed by soldering while urethane coating of wire is melted. The terminal drawer 5 is cut off as to the bobbin chuck 2 after moving to the next station. A terminal pin 7 is wired and soldered again at lower temperatures at the next station. This time, as temperatures are in the neighborhood of 250 to 270 deg.C, no damage is caused to a terminal board 6 of resin comparatively weak against heat. |
