发明名称 High thermal conductivity dielectric tape
摘要 An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer ( 24 ) that has mica particles/flakelets ( 6 ), filler particles ( 26 ) and a binder resin ( 28 ), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets ( 30 ), filler particles ( 32 ) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.
申请公布号 US2008066942(A1) 申请公布日期 2008.03.20
申请号 US20060523238 申请日期 2006.09.19
申请人 SIEMENS POWER GENERATION, INC. 发明人 MILLER MARK L.
分类号 H01B11/06 主分类号 H01B11/06
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