| 摘要 |
PURPOSE:To perform position matching by a method wherein the surface of a substrate on a block and the lower surface of a chip in a supporting tool are projected by an optical system, two photopaths are intercepted alternately, a pattern obtained from the optical system is binarized to determine a position, the amount of slippage from a reference pattern is calculated and the block or supporting tool is controlled and moved. CONSTITUTION:The substrate 3 and the chip 1 are fitted to the block 5 and the supporting tool 13 respectively, a shutter 21 is advance to intercept the photopath of a chip pattern, while a substrate pattern is projected on the screen of TV16, binatized 23, compared 24 with the reference pattern to calculate 25 the amount of slippage, and the block 5 is controlled and driven 26 to turn the slippage into zero. Next, a shutter 22 is advanced to intercept the photopath 18 of the substrate pattern, the photopath 17 is opened to project the chip pattern on the screen of TV16, whereby it is made to accord with the reference pattern. As the result, the chip pattern is correctly positioned on the substrate pattern. Then, the shutter 22 is moved back, a supporting body 14 is made to approach the block 5 and the bump electrode 2 of the chip 1 is laid on the wiring layer 4 of the substrate 3 to be heated for connection. By this constitution, the position matching can be performed automatically and thereby the efficiency of operation is improved. |
