| 摘要 |
<p>A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70 DEG , a solid polyanhydride curing agent at least about 50 mole % of which is trimellitic anhydride, and a cross-linking agent having the general formula R3SnX where each R is selected from alkyl, aryl, aralkyl, and alkaryl up to C20 and X is selected from acetate, propionate, butyrate, halogen, and hydroxyl. The composition is dry-blended and then melt-mixed at 50 DEG to 150 DEG C. To prepare the coating powder, it is then cooled, crushed, and ground to a particle size of less than 100 microns. The coating powder is electrostatically applied to a conductor and is cured above the melting point of the resin.</p> |
