| 摘要 |
A bonding apparatus for applying a thermoplastic-adhesive coated core material to a moving substrate as disclosed. Heat exchanger guide means directs a continuous length of hot melt strand to an output orifice at a bonding station. The hot melt adhesive is softened by the unique heat exchanger means to its flow point, just before the strand leaves the output orifice. A rapidly replaceable bonding shoe presses the hot melt strand onto a substrate moving past the bonding station, as soon as the heated strand leaves the output orifice, thus bonding the strand to the moving substrate. Biasing means selectively provides presettable compression or tension forces to the bonding shoe, as required by the particular bonding application. Optional cooling apparatus positioned immediately downstream from the bonding station, further compresses the hot melt strand on the substrate and cools the adhesive to bonding consistency. |
