发明名称 |
Resin encapsulated capacitors - mfd. by dipping heated in resin powder and pressing to shape in mould |
摘要 |
<p>Electrical capacitors are encapsulated in a thermosetting plastic, preferably an epoxy resin, by a preliminary covering of the capacitor with resin, followed by introducing it in a press mould and curing the plastic. The preliminary covering is achieved by heating the capacitor and by dipping it, suspended from the connecting leads, one or more times into a resin powder. An alternative method is an electrostatic process to envelop the capacitor by a fused or sintered powder layer. The resin includes preferably a suitable filler. This is a simple method of producing thin, uniform and smooth coverings of capacitors.</p> |
申请公布号 |
DE2131894(B2) |
申请公布日期 |
1980.09.25 |
申请号 |
DE19712131894 |
申请日期 |
1971.06.24 |
申请人 |
WESTERMANN, WILHELM, 6800 MANNHEIM |
发明人 |
WESTERMANN, WILHELM, 6800 MANNHEIM |
分类号 |
B29C41/14;B29C43/00;B29C70/72;H01G2/12;(IPC1-7):01G1/02 |
主分类号 |
B29C41/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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