发明名称 Resin encapsulated capacitors - mfd. by dipping heated in resin powder and pressing to shape in mould
摘要 <p>Electrical capacitors are encapsulated in a thermosetting plastic, preferably an epoxy resin, by a preliminary covering of the capacitor with resin, followed by introducing it in a press mould and curing the plastic. The preliminary covering is achieved by heating the capacitor and by dipping it, suspended from the connecting leads, one or more times into a resin powder. An alternative method is an electrostatic process to envelop the capacitor by a fused or sintered powder layer. The resin includes preferably a suitable filler. This is a simple method of producing thin, uniform and smooth coverings of capacitors.</p>
申请公布号 DE2131894(B2) 申请公布日期 1980.09.25
申请号 DE19712131894 申请日期 1971.06.24
申请人 WESTERMANN, WILHELM, 6800 MANNHEIM 发明人 WESTERMANN, WILHELM, 6800 MANNHEIM
分类号 B29C41/14;B29C43/00;B29C70/72;H01G2/12;(IPC1-7):01G1/02 主分类号 B29C41/14
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