| 摘要 |
A method of forming a defined conductive pattern in a laminar film comprising a thin gold layer interposed between an insulating substrate and a ceramic overlay is disclosed. A base etchant is employed to remove the thin ceramic layer but itself will not etch or remove the gold film layer. Upon removal of the ceramic layer, the exposed gold layer may be removed without any chemical treatment or assistance. Such removal may, for example, be accomplished by fluid agitation or exposure to a fluid stream or by swabbing. A pretreatment of the film surface prior to etching enhances the adhesion of the photoresist subsequently applied to the film surface.
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