| 摘要 |
PURPOSE:To improve the yield and reduce the cost when forming many semiconductor elements on the crystal surface 111 of the substrate by always making the side direction of the element held by a jig agree with the substrate orientation flat direction. CONSTITUTION:Many elements 3 of which the side a is parallel to the flat 2 and the side b is at right angle to the flat 2; or the side b' is parallel to the flat 2' and the side a' meets the flat 2 at right angles, are formed on the Si substrate 1 of the 111 crystal surface where the orientation flat 2 is installed. Next thereto, the element 3 and the element 3' are divided into pellets and the pellet 4 lateral wall 5 of the element 3 divided at this time is vertical, however, an angle of theta=57 deg. is produced at the element 3' pellet 6 lateral wall 7. Thereafter, these pellets are held with a pincette 8 or a collet 9 to perform bonding, however, the pellet 6 is apt to get damages, therefore, a pellet is formed to have the element direction held by a jig agree with the flat direction. |
