| 摘要 |
<p>PURPOSE:To simplify circuit modification and reduce the cost, by laminating a Y-axis pattern layer and X-axis pattern layer on the backside of a mother circuit board. CONSTITUTION:Y-axis conductor pattern 15 of a Y-axis pattern layer 10 and X-axis conductor pattern 25 of a X-axis pattern layer 20 crosses at their lattice intersecting points, and the positions of the intersecting points correspond to those of through holes 2. the Y-axis conductor pattern 15 and the X-axis conductor pattern 25 are insulated by insulating films 16, 27. In addition, the Y-axis conductor pattern 15 and the through holes 2 are insulated each other by an insulating film 17. And, when lattice intersecting points are selectively pushed and heated, only the insulating films 16, 17, 26, 27 are melted and removed without damaging the frame rims of windows 12, 22 of polyimide films 11, 21, and the Y-axis conductor pattern 15 and the X-axis conductor pattern 25 are thermally bonded, enabling conduction between them. Therefore, by selecting intersecting points of the lattice and connecting the Y-axis conductor pattern 15 and the X-axis conductor pattern 25 at the positions of the intersecting points of the lattice, a plurality of through holes 2 at the desired positions can be connected. Thus, a multilayer circuit substrate suitable for general purposes is obtained.</p> |
