| 摘要 |
PURPOSE:To improve shape and dimensional accuracy (such as thickness, etc.) of an electric circuit resin forming base board of a radiating indicaotr, etc., and to simplify the manufacturing process thereof by allowing an electric circuit, which is a lead frame, to be formed with resin. CONSTITUTION:A hoop-like lead frame 1 is tightly fixed onto a forming metallic mold, molten resin 2 is poured into the mold and the lead frame 1 is fixed onto surface of the resin 2. After completion of the forming process, waste portions of the lead frame 1 are cut off and an electrode 3 is bent. |
