发明名称 Method for laser trimming of bi-FET circuits
摘要 Radiant energy, preferably that of a laser, is focused onto the surface of a silicon integrated circuit that contains a thin layer doped to the opposite conductivity type of the underlying silicon. The thin layer can be trimmed so as to tailor its conductivity. Such layers when used in JFET, diode, bipolar transistor, or resistor structures can therefore be precision trimmed. In particular, JFET pairs can be trimmed to a very close match.
申请公布号 US4172741(A) 申请公布日期 1979.10.30
申请号 US19770830979 申请日期 1977.09.06
申请人 NATIONAL SEMICONDUCTOR CORP 发明人 JOHNSON, ROBERT F
分类号 H01L29/80;H01L21/268;H01L21/302;H01L21/337;H01L21/822;H01L21/8232;H01L27/04;H01L27/06;H01L29/808;(IPC1-7):H01L21/26;B23K9/00 主分类号 H01L29/80
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