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发明名称
METHOD AND APPARATUS FOR THERMALLY BONDING SEMICONDUCTOR COMPONENTS TO CARRIERS
摘要
申请公布号
CA795997(A)
申请公布日期
1968.10.01
申请号
CAD795997
申请日期
申请人
SIEMENS-SCHUCKERTWERKE AKTIENGESELLSCHAFT
发明人
HEINZ-HERBERT ARNDT;JURGEN SCHADEL
分类号
主分类号
代理机构
代理人
主权项
地址
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