| 摘要 |
PURPOSE:To prevent not only a lowering of reliability due to impurities but also slipping off of a heat sink in operation of a manufacturing process and then improve a yield by installing the heat sink with a plating process. CONSTITUTION:Connection plating 4 extending over two connection parts which are consist of an insulating substrate 1, an outer lead 2, and an insulating heat sink 3 and are in contact with each other is formed at end edges by plating the above two connection parts after putting one connection part on top of the other and performing alignment of them. The foregoing two connection parts: a part between the substrate 1 and the outer lead 2; the other part between the outer lead 2 and the heat sink 3 are connected after obtaining a sufficient strength. After that, a semiconductor element 5 is mounted on the substrate 1 and then the element 5 is connected to the substrate 1 through a metallic thin wire 6. Then these elements are sheathed with a resin 7 and are protected from an outside atmosphere. In this way, the installment of the heat sink may solve matters which become serious problems described below: a semiconductor element is liable to be destroyed due to impurities which is contained in adhesive and then its element is not allowed to be used for a part which requires high reliability. |
