| 摘要 |
1493486 Heat sinks for semiconductor devices INTERNATIONAL RECTIFIER CO (GREAT BRITAIN) Ltd 13 Feb 1976 [18 Feb 1975] 6786/75 Heading H1K A semiconductor device is clamped to a flat contact face on the solid hub of a wheel-shaped heat sink, the vane-like spokes of which are integral with or rigidly secured to the hub and rim. As described the sink is a unitary cast or extruded aluminium structure with the opposed faces of its hub machined flat and with a flat on its rim to which a lead may be bolted. Typically (Fig. 2A) a rectifier or thyristor device of the "hockey-puck" type is mounted between the hubs of two such sinks, the rims of which are clamped together as shown by a set of spring tensioned high tensile rods 8, the clamping pressure being communicated to the device via pressure washers 6, 7 the flanged and webbed interlocking insulating members 4, 5 and spokes 2, 3. A member containing ducting or a fan may be attached to the end of the structure as shown. Further rectifier elements and heat sinks may be introduced between the end sinks (Fig. 3A, not shown) to form a stack. |
