PROCESS FOR INHIBITING CORROSION AND REMOVING CONTAMINANT FROM A SURFACE DURING AND COMPOSITION USEFUL THEREOF

摘要

OF THE DISCLOSURE PROCESS FOR INHIBITING CORROSION AND REMOVING CONTAMINANT FROM A SURFACE DURING WAFER DICING AND COMPOSITION USEFUL THEREOF 5 ADHERENCE OF CONTAMINANT RESIDUES OR PARTICLES IS SUPPRESSED, CORROSION OF EXPOSED SURFACES IS SUBSTANTIALLY REDUCED OR ELIMINATED DURING THE PROCESS OF DICING A WAFER BY SAWING. A FLUORIDE-FREE AQUEOUS COMPOSITION COMPRISING A DICARBOXYLIC ACID AND/OR SALT THEREOF, A HYDROXYCARBOXYLIC ACID AND/OR SALT THEREOF OR AMINE GROUP 1 0 CONTAINING ACID, A SURFACTANT AND DEIONIZED WATER IS EMPLOYED.