| 摘要 |
PURPOSE:To prevent a semiconductor slice from breaking or ununiform polishing when polishing the face opposite from the semiconductor element forming face of the slice, by providing a protecting plate for carrying the slice with grooves in columns and rows for receiving regularly arranged projections for forming elements so that the rear face is polished with the plate surface other than the grooves applied to the slice face other than the projections. CONSTITUTION:Projections 2 for forming elements are provided on the surface of a semiconductor slice 1 to be arranged regularly. The rear face of the slice 1 is polished to a desired thickness with a protector 6 applied to the faces of the projections 2. The protector 6 is provided on its surface with grooves 7 for receiving the projections 2 so that the surface other than the grooves abuts to the slice 1. The protector 6 thus arranged is put on a platen 4 with the rear face of the protector applied to the platen, and the rear face of the slice 1 is polished with a grind wheel 8. In such a manner, it is prevented that the cuttings of polished material infiltrate into the projections 2. |
