| 摘要 |
<p>PURPOSE:To realize highly accurate separating work by a method wherein separating grooves are formed by etching in the main surfaces of an object to be separated and the object is completely separated along those grooves. CONSTITUTION:Masking films 6 are applied to the respective main surfaces 1a and 1b of a wafer 1 which is an object to be separated. Then exposure lines 7 are formed in the masking films 6 between adjacent pellets 2 and 2 so as to face scribe lines 4. Then the wafer 1, in which the exposure lines 7 are formed in the masking films 6, is etched and separating grooves 5 are dug along the exposure lines 7 on the scribe lines 4. The masking films 6 are removed after the separating grooves 5 are formed. After the wafer 1 is subjected to predetermined processes while it is being kept unified by connecting parts 9, the connecting parts 9 are fused by applying a laser beam 10 to the bottoms of the separating grooves 5 and the wafer 1 is separated completely into respective pellets 2. With this constitution, complete separation of a wafer can be realized with high accuracy and easily.</p> |
