发明名称 Tape head assembly
摘要 A tape head assembly 100 comprises a transducer head 120 having plural arrays of transducing elements 125, 130, the transducing elements 125, 130 comprising at least one of write elements and read elements. The tape head assembly 100 further comprises a set of conditioning elements, the conditioning elements comprising at least one of write drivers (460) and read amplifiers (260). Multiplexing circuitry (230, 430) selectively couples the conditioning elements to one of the plural arrays of transducing elements 125, 130. The tape head assembly 100 forms part of a tape drive 500 and is mounted on an interconnect structure 163, along with the write circuitry 140. The read circuitry 110 is mounted separately on a circuit board.
申请公布号 GB2409330(A) 申请公布日期 2005.06.22
申请号 GB20040027495 申请日期 2004.12.15
申请人 * HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 LAWRENCE A * HANSEN;RALPH F JR * SIMMONS
分类号 G11B5/39 主分类号 G11B5/39
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