发明名称 RECEIVER CHIP MADE IN ONE-CHIP WHICH IS FORMED ON UNIFORMED MATERIAL RECEIVING PATHS OF DUAL FREQUENCY BAND
摘要 The present invention relates to a receiver chip formed on a monolithic semiconductor integrated circuit substrate. The receiver chip comprises a first receiver chip for receiving terrestrial digital multimedia broadcasting signals, a second receiver chip for receiving satellite digital multimedia broadcasting signals, and the monolithic semiconductor integrated circuit substrate. The first and second receiver chips are stacked and bonded on the monolithic semiconductor integrated circuit substrate.
申请公布号 KR100726794(B1) 申请公布日期 2007.06.11
申请号 KR20050067808 申请日期 2005.07.26
申请人 发明人
分类号 H01L25/04;H04N5/44;H04N7/00 主分类号 H01L25/04
代理机构 代理人
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