| 摘要 |
The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5x10<SUP>4 </SUP>or greater, represented by an average composition formula: <?in-line-formulae description="In-line Formulae" end="lead"?>R<SUP>1</SUP><SUB>a</SUB>(OX)<SUB>b</SUB>SiO<SUB>(4-a-b)/2 </SUB><?in-line-formulae description="In-line Formulae" end="tail"?> (wherein, R<SUP>1 </SUP>represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula -SiR<SUP>2</SUP>R<SUP>3</SUP>R<SUP>4 </SUP>(wherein, R<SUP>2 </SUP>to R<SUP>4 </SUP>are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0<b<2, and a+b satisfies 1.00<a+b<2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element.
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