发明名称 METHOD FOR TREATING MULTIPLE-LAYER SUBSTRATES
摘要 The invention relates to the treatment of multi-layer substrates (1) by means of a laser (2, 6). Parameters for treating the individual layers cannot be adjusted in an optimal manner. The aim of the invention is to obtain pulse trains with increased pulse frequency for improving the treatment speed as well as higher energies per pulse while simultaneously impinging the substrate (1) with pulses of two solid-state lasers (2, 6). To this end, two solid-state lasers (2, 6) which are represented on the multi-layer substrate (1) via a mutual deflection unit (5) are used. An optimised treatment of the substrate can optionally be obtained by adapting the laser parameters to the individual layers (8, 9).
申请公布号 WO0119146(A1) 申请公布日期 2001.03.15
申请号 WO2000DE02980 申请日期 2000.08.31
申请人 SIEMENS AKTIENGESELLSCHAFT;STEUR, HUBERT;HEERMAN, MARCEL;ROELANTS, EDDY 发明人 STEUR, HUBERT;HEERMAN, MARCEL;ROELANTS, EDDY
分类号 B23K26/06;B23K26/40;B23K26/402;H05K3/00 主分类号 B23K26/06
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