发明名称 FORMATION OF AN EMBEDDED CAPACITOR PLANE USING A THIN POLYIMIDE DIELECTRIC
摘要 A capacitor, which is comprised of a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applyin g a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
申请公布号 CA2354753(A1) 申请公布日期 2002.02.24
申请号 CA20012354753 申请日期 2001.08.07
申请人 OAK-MITSUI, INC. 发明人 SMITH, GORDON;ZIMMERMAN, SCOTT;SKORUPSKI, EDWARD C.;ANDRESAKIS, JOHN A.
分类号 H01G4/30;H01G4/10;H01G4/18;H01G4/20;H01L25/00;H05K1/16;H05K3/14;(IPC1-7):H01G4/33;H01G4/018 主分类号 H01G4/30
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