| 摘要 |
The electronic-part built-in substrate includes a coreless substrate 11 in which a wiring pattern 31 is formed in laminated insulating layers 26 and 27 , a semiconductor chip 14 electrically connected to the wiring pattern 31 , a resin layer 13 configured to cover a first main surface of the coreless substrate 11 and to have an accommodating portion 57 that accommodates the semiconductor chip 14 , and a sealing resin 19 that seals the semiconductor chip 14 accommodated in the accommodating portion 57.
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