| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component that has both excellent durability and high reliability after the component is mounted, and to provide a method of manufacturing the component and an electronic device. <P>SOLUTION: In the first electronic component of this invention, a first substrate 1 and a second substrate 10 are disposed to face each other and solder bumps are individually disposed between the plurality of conductive sections 6 of the first substrate 1 and the plurality of conductive sections 12 of the second substrate 10. The solder bumps are provided with at least one solder bump α8A which has an outwardly projecting side face having a radius of curvature larger than that of a circle having the diameter which is equal to the interval between the first and second substrates 1 and 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
