发明名称 SOLDERING METHOD FOR BOARD AND SOLDER FEEDING DEVICE
摘要 PROBLEM TO BE SOLVED: To feed solder to the soldering pad to be formed on a board without fail. SOLUTION: This soldering method contains a masking process in which a mask 25 is arranged on a board 23, where a pad is formed, by exposing a pad 23a only, a flux application process wherein a flux is applied to the pad, and a soldering process wherein solder balls, consisting of solder particles, are adhered.
申请公布号 JPH11204927(A) 申请公布日期 1999.07.30
申请号 JP19980006941 申请日期 1998.01.16
申请人 FUJITSU DENSO LTD 发明人 NAKAHARA KOJI
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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