摘要 |
PROBLEM TO BE SOLVED: To feed solder to the soldering pad to be formed on a board without fail. SOLUTION: This soldering method contains a masking process in which a mask 25 is arranged on a board 23, where a pad is formed, by exposing a pad 23a only, a flux application process wherein a flux is applied to the pad, and a soldering process wherein solder balls, consisting of solder particles, are adhered. |