| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for easily inspecting a stencil mask for use in a process of exposing a semiconductor wafer by the use of a charge particle beam by a method directly connected to a manufacturing process. <P>SOLUTION: A stencil mask 1 is fixed above a semiconductor wafer 3 coated with a resist 11 on its surface 3a at a fixed distance. When a charge particle beam injector 5 irradiates a charge particle beam 9 to the stencil mask 1 and the semiconductor wafer 3 while moving to a scan direction 7, the charge particle beam 9 exposes the resist 11 through a stencil mask 17 existing in an irradiation range 13 and also electrifies the semiconductor wafer 3. An electrified charge amount depends on the stencil mask 17 existing in the irradiation range 13, and the electrified charge amount is measured, thereby inspecting the opening state of the stencil mask in the irradiation range 13. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
