COMPOSITION USING BLOCKED ISOCYANATE GROUP FOR CIRCUIT ADHESION, WHICH COMPRISES MONOMER HAVING CARBON DOUBLE BOND, AZO COMPOUND, PEROXIDE, CONDUCTIVE PARTICLE, AND COMPOUND HAVING AT LEAST ONE BLOCKED ISOCYANATE GROUP

摘要

PURPOSE: A composition for circuit adhesion is provided, to obtain excellent mechanical properties, adhesion strength, fast-curing property and processability and a low curing temperature. CONSTITUTION: The composition comprises a monomer having a carbon double bond; an azo compound; a peroxide; 0.1-10 wt% of a conductive particle; and 0.1-50 wt% of a compound having at least one blocked isocyanate group. Preferably the compound having at least one blocked isocyanate group is obtained by reacting a compound having an isocyanate group with any one selected from the group consisting of caprolactam, imidazole, pyrazole, pyrazolinone, 1,2,4-triazole, diketopiperazine, malonate and oxime, and has a heat activation temperature of 70-200 deg.C.