| 摘要 |
PURPOSE: A semiconductor memory device is provided to reduce a power consumption, a loss of a data transmission speed and a chip size, and to perform a forward package and a reverse package. CONSTITUTION: A semiconductor memory device includes the first and second memory core blocks(311/313,321/323), a pad block(351), an input/output and internal clock signal generating block(340), a data shift block(361) and an interface logic block(331). The an input/output and internal clock signal generating block has a data input/output portion(341) communicating with an external system, a command input portion(342) receiving a command from outside, and a delay locked loop circuit(343) receiving an external clock signal and generating an internal clock signals. The data shift block communicates with the data input/output portion and the first and second memory core blocks in synchronization with the internal clock signal. The interface logic block is laid out between the first memory core block and the pad block. The input/output and internal clock signal generating block and data shift block is sequentially laid out between the pad block and the second memory core block.
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