| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability by improving bonding strength at a connection interface between a via and wiring.SOLUTION: A wiring board 1 comprises: a resin substrate 10; front wiring 11 formed to be buried on one surface (surface 10a) side of the resin substrate 10; a conductive via 12 which penetrates the resin substrate 10 and is formed integrally with the front wiring 11; rear wiring 13 which is formed on the other surface (rear surface 10b) side of the resin substrate 10 and is connected to the conductive via 12; and a metal connection layer 14 forming an interface between the conductive via 12 and the rear wiring 13. |
