TEST RESULT MARKING OF ELECTRONIC PACKAGES

摘要

A number of electronic die are attached to an interconnect structure (e.g., a lead frame, a substrate, a panel, or a strip). The die are encapsulated to provide a number of unsingulated packages of an overall package assembly. The unsingulated packages are then tested, and test results for each package are automatically marked on encapsulant corresponding to the package. The packages are then singulated after the automated machine marking, and sorted according to the markings.