| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of transfer times for a substrate to be processed in a substrate processing system and to reduce the quantity of foreign materials adhered to the back of the substrate to be processed, by connecting plural intra-device transportation mechanisms to an inter-device transportation mechanism. SOLUTION: A substrate processing system 1 is constituted of a carrier device 2, plural processors 3, 4 and 5 (cleaning processing, application processing, exposure processing, developing processing and the like, for example) and an inter-device transportation mechanism 6. The processor 3 is constituted of plural processing mechanisms 3A, 3B and 3C and an intra-device transportation mechanism 8. The processors 4 and 5 are similarly constituted of plural processing mechanisms 4A, 4B and 4C; 5A, 5B and 5C and the intra-device transportation mechanism 8. The intra-device transportation mechanisms 8 carry out the processed substrate from the processing mechanism and transport the substrate so that the substrate which is transported from the other device and which is not processed is stored in the processing mechanism. |
