| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer prober which is capable of adjusting the amount of overdrive (contact pressure) properly independently of the types of probe cards. SOLUTION: A scanning probe microscope 19 is provided to the electrode pad of an IC formed on a wafer 12 so as to measure the depth of a needle trace (application of a needle) which is formed by contact with the electrode probe 13 of a probe card 14. The probe card 14 and the scanning probe microscope 19 are disposed in an array, and the wafer 12 is held by a wafer chuck 15 and horizontally moved by a horizontal moving mechanism 16 between the application position of a needle under the probe card 14 and the measurement position of a needle trace under the scanning probe microscope 19. An up/down moving mechanism 17 drives the wafer chuck 15 at the application position of the needle, and brings the needle into contact with the wafer 12 with a prescribed amount of overdrive. A depth judging unit of the needle trace located in a control unit 20 corrects the amount of overdrive when the depth of a needle trace, which is measured by the scanning probe microscope 19, is out of a specification range. COPYRIGHT: (C)2008,JPO&INPIT
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