发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which reduces the occurrence of splash more and is more inexpensive and reliable, and to provide a manufacturing method thereof. SOLUTION: The electronic component has: a metallic cap 2 having a flange; a base 1 having a flange and a metallic lead terminal 12; and an electronic element mounted on the base, and is airtightly sealed by covering the base with the cap and resistance-welding the flange of the cap to the flange of the base while the former abuts on the latter, wherein only electrolytic nickel plating 15 is formed at a metal part that includes a flange part on which the base of the cap abuts and a flange part on which the cap of the base abuts, the flange parts being in a surface of the cap and a surface of the base, and that is exposed on an internal surface and at least electroless nickel plating 16 is formed on a terminal exposed on an external surface. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009021270(A) 申请公布日期 2009.01.29
申请号 JP20070180492 申请日期 2007.07.10
申请人 DAISHINKU CORP 发明人 IIZUKA MINORU
分类号 H01L23/04;H01L23/02;H03H3/02;H03H9/02 主分类号 H01L23/04
代理机构 代理人
主权项
地址