发明名称 CIRCULAR SUBSTRATE AND PROCESSING METHOD AND DEVICE FOR CIRCULAR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a circular substrate and its processing method and device in which adverse effect is eliminated from the products caused by burr dust or the like dropped from the outer edge section of a substrate after a blanking process. SOLUTION: The circular substrate is a blanked substrate and has a feature in which burrs of the outer edge section are eliminated from the substrate. The processing method includes a process in which burr removing work is applied for the outer edge section of the blanked substrate and a process in which burr dust generated by the burr removing process is eliminated from the substrate. The processing device is provided with a burr removing means having a guiding member to which the outer edge section of the blanked substrate contacts and rotates and a burr dust eliminating means in which burr dust adhered to the substrate is eliminated. The contacting and rotating length of the guiding member with the outer edge of the substrate is so sufficient that the substrate rotates equal to or more than one revolution while it is moving. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006155788(A) 申请公布日期 2006.06.15
申请号 JP20040346662 申请日期 2004.11.30
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TAKAHASHI HIDEKI;MORI TAKASHI;OZEKI YASUYUKI
分类号 G11B5/73;B21D19/00;G11B5/84 主分类号 G11B5/73
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