| 摘要 |
PURPOSE: A ball grid array package having a ball buffer layer and manufacturing method thereof is provided, which uses a solder ball as an external connecting terminal and forms a ball buffer layer on a surface which the solder ball is formed. CONSTITUTION: The ball grid array package comprises: a wiring substrate having an upper surface and a lower surface; semiconductor chips (52, 112) to be populated on the upper surface of the wiring substrate; shape resins (56, 116) for seaming the semiconductor chip portion populated on the upper surface of the wiring substrate; solder balls (70, 130) to be fused on the lower surface of the wiring substrate and electrically coupled to semiconductor chips (52, 112); and ball buffer layers (18, 180) for covering the lower surface of the wring substrate and the solder ball portion adjacent to the lower surface. Therefore, the badness, which the boundary surface between the solder ball and a solder ball pad is broken by a thermal stress, can to be restrained.
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