| 摘要 |
PROBLEM TO BE SOLVED: To apply coating liquid uniformly in the substrate plane, while limiting the supply amount of coating liquid, when applying the coating liquid uniformly on the substrate.SOLUTION: In a method for applying the coating liquid onto a wafer, a solvent of coating liquid is supplied onto the wafer, a liquid membrane of the solvent is formed annularly on the outer periphery of the wafer, the coating liquid is supplied to the central part of the wafer while rotating the wafer at a first rotational speed (time t-t), and then the coating liquid is diffused on the substrate by rotating the wafer at a second rotational speed higher than the first rotational speed (time t-t). The solvent is supplied continuously before the second rotational speed is reached and the coating liquid comes into contact with the liquid membrane of the solvent (time t-t).SELECTED DRAWING: Figure 7 |
