| 摘要 |
Provided are a composition for grinding, which can achieve both excellent surface quality and high grinding speed, and a method for grinding a silicon substrate. The composition for grinding contains abrasive grains, a basic compound, and at least one of a multiple bond-containing compound or an anionic group-containing compound. The basic compound contains at least one of an alkali metal hydroxide, an alkali metal bicarbonate, an alkali metal carbonate, a cyclic compound, an ionic compound, and a cyclic diamine compound. |
